IC & SENSOR PACKAGING EXPO
Date
2025-1-22(Wed) to 2025-1-24(Fri)
Host Area
Japan
Venue
Tokyo Big Sight
Official website
Booth No.
East Hall 7 Booth No. E65-1
Our booth overview
As the electrification of automobiles and the shift to 5G and higher functionality in smartphones accelerates, there is also a growing need for high-functionality, high-precision, high-quality microfabrication in the fields of electronic components and electronic materials.
Tokyo Seimitsu has always been actively engaged in technological development, not only in the field of semiconductors, but also in the fields of electronic components and electronic materials, proposing processes and precision fabrication. We will continue to deliver even more products to you by combining our long-standing advanced know-how and the latest technology.