Semiconductor Manufacturing Equipment
Polish Grinders
Polish Grinders
The polish grinder is a single machine that can both slice various device wafers and remove damage,
which has been developed from a unique idea of ACCRETECH-Tokyo Seimitsu.
In recent years, the grinder also contributes to various grinding and polishing processes required
for advanced packaging technologies such as laminated memory and FO/2.5D/3D.

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