History

Develops Japan's first LVDT type electric micrometer Establishes
Daiichi Seiki Co., Ltd.

Renames the Company as Tokyo Seimitsu Co., Ltd.
Stock is listed on the Tokyo Stock Exchange 2nd Section
Develops surface texture measuring instrument

Develops Japan's first wafer slicing machine Opens Hachioji Plant

Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to China

Establishes Tosei Engineering Service Co., Ltd. (currently Tosei Engineering Corp.)
Opens Tsuchiura Plant
Develops Japan's first coordinate measuring machine

Stock is listed on the Tokyo Stock Exchange 1st Section
Appoints Goro IMAZAWA as chairman

 Establishes TOKYO SEIMITSU EUROPE GmbH (GERMANY) and TOKYO SEIMITSU AMERICA, INC. (USA)

Appoints Hideo OHTSUBO as chairman
Acquires Silicon Technology Corporation (STC) of the United States
Establishes TSK Service Center in Korea
Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.

ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants
Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser"
Establishes Beijing Representative Office is established
Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.

Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge"
Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China
Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States
Enters into partnership with Carl Zeiss in the field of high precision measuring instruments
Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machines

Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.)
Establishes TSK Technical Center in Hsinchu, Taiwan
Establishes TOKYO SEIMITSU (ISRAEL) LTD.

Opens New Nagoya Plant of Tosei Engineering
Receives "10 BEST Award" for 2nd consecutive year
Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD.
Integrates U.S. subsidiaries into TSK AMERICA, INC.

Hachioji and Tsuchiura plants obtain ISO 14001 certification
Receives "10 BEST Award" for 3rd consecutive year

Inaugurates new head office of Tosei Engineering in Tsuchiura
Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. to support the development, manufacture and sale of wafer inspection systems
Establishes TSK FINANCE CO., LTD.
Receives "10 BEST Award" for 4th consecutive year
Initiates business partnership for wire saws and related devices with HCT of Switzerland
Unveils New symbol mark at SEMICON Japan

Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel
Receives "10 BEST Award" for 5th consecutive year
Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp.
Develops wafer inspection system
Develops world's first polish grinder

Introduces corporate brand "ACCRETECH"
Opens new Hachioji Main Plant Building
Receives "10 BEST Award" for 6th consecutive year
Establishes LEEPL Technology Consortium
Establishes TSK Box Corp.
Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD.
Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd Section

Introduces Executive Officer System and In-House Company System at Semiconductor Company, Metrology Company and Administration Company
Establishes ACCRETECH (CHINA) CO., LTD., an affiliated company in China
Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD.
Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD.
Renames TSK AMERICA, INC. as ACCRETECH USA, INC.
Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD.
Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD.
Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD.
Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD.
Receives "10 Best Award" in two categories: Test & Material Handling Equipment category (7th consecutive year) and Assembly Equipment category (first time)
Develops next-generation wafer inspection systems in conjunction with Hitachi High Technologies Corp.
Jointly develops new laser dicing equipment, MAHOHDICING MACHINE, for semiconductor manufacturing equipment market, together with Hamamatsu Photonics K.K.
Develops Chemical Mechanical Planarizer (CMP)

Separates Roles of Chairman & C.E.O. and President & C.O.O.
Appoints Hideo OHTSUBO as Chairman & C.E.O.
Appoints Sadakatsu SUZUKI as President & C.O.O.
Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (8th consecutive year), Assembly Equipment category (2nd consecutive year; ranked No.1)
Develops E-beam lithography system

Receives "10 BEST Award" in two categories: Test & Material
Handing Equipment category (9th consecutive year), Assembly
Equipment category (3rd consecutive year; ranked No.1)

New Semiconductor Plant Hachioji Completed
New Measuring Instrument Plant in Tsuchiura Completed
Receives "10 BEST Award" in two categories: Test & Material Handing Equipment category (10th consecutive year), Assembly Equipment category (4th consecutive year; ranked No.1)
Sadakatsu SUZUKI, President & C O O, named President C E O & C O O
Hideo OHTUBO, former Chairman and present Principal Adviser, became the first foreigner to be bestowed the title of Honorary Adviser of the CSIA(China Semiconductor Industry Association)
Renewed partnership agreement with Carl Zeiss for another 5 years

Receives "10 BEST Award" in two categories
Test & Material Handing Equipment category (11th consecutive year),
Assembly Equipment category (5th consecutive year; ranked No.1)
Released "UF3000EX" that supports the last generation of 300mm Wafer prober.

Establishment of Accretech Korea Co., Ltd.
MAHOH DICING MACHINE was granted the Chairman' Award of The Japan Machinery Federation at its 27th JMF Award for Energy-Conserving Machinery.
Received the "10 BEST Awards" in two categories:
awarded for 12 consecutive years in the Test & Material Handing Equipment category, and for 6 consecutive years in the Assembly Equipment category
Obtained a business license at Tsuchiura Plant under the traceability system of the Measurement Law for the calibration of the "length measurement laser" and "3D Coordinate Measuring Machine"
Separation of roles of C E O & C O O
Kazuo FUJIMORI named C O O
Establishment of ACCRETECH Taiwan Co., Ltd

Recieved the "10 BEST Awards" in two categories:
awarded for 13 consecutive years in the Test & Material Handing Equipment category, and for 7 consecutive years in the Assembly Equipment category
Technical cooperation with Mitaka Kohki Co., Ltd in non-contact metrology

Establishment of Tokyo Seimitsu USA Branch
Appointment of Mr. Kazuo FUJIMORI as CEO.

Establishment of Tokyo Seimitsu USA Branch

Appointment of Mr. Kunimasa OTA as CEO.
Started mass-production of "AD3000T/S" of the world's smallest and fastest dicing machine in the most advanced semiconductor line.
Establishment of the local corporation, Tokyo Seimitsu （Thailand）　Co., Ltd..

Establishment of "ACCRETECH Application Center" corresponding to the diversification of the device process.
Began manufacturing, development and sales upon "the acquisition of precision blade business" from Mitsubishi Materials.
Opened the representative office Tokyo Seimitsu Co., Ltd. Indonesia.

Establishment of the local corporation, ACCRETECH Vietnam Co.,.
Released non-contact sensor "Opt-measure."

Appointment of Mr. Hitoshi YOSHIDA as CEO.
Released Non-contacted/three-dimensional surface roughness and contour measuring instrument "Opt-scope."
Establishment of PT. ACCRETECH Indonesia
Establishment of ACCRETECH ADAMAS （Thailand）Co., Ltd.

Construction of new plant (No.6 Plant） in Hachioji was completed
Tsuchiura plant of Metrology Company obtained the certification of JIS Q 9100 (Scope of Certification: Shape measurement of order received parts)

Cooperated with Panasonic Factory Solutions Co., Ltd. in the development of laser grooving devices
Published the ACCRETECH Declaration on Women's Advancement
Released high accuracy CNC coordinate measuring machine XYZAX AXCEL
Released SURFCOM TOUCH series of intuitive operation type surface texture measuring instruments

Released RONDCOM CREST, ultra-high precision roundness and cylindrical profile measuring instrument
Released AltaProv, multi-stage prober for wafer collective measurement

Purchased a majority shareholding in Fujitsu Telecom Networks Fukushima Limited (now Accretech Powertro System Co., Ltd.) which provides Charge/Discharge testing systems and became a subsidiary.
Tosei Engineering Corp. and its subsidiary Tosei America Inc. acquired the balancer business from the US manufacturer Schmitt Industries Inc. 

Renovation for expanding sales and service/support capability of Osaka branch was completed
Construction of new plant (MI Building) in Tsuchiura was completed

Construction of new building for Tokyo Seimitsu subsidiary Accretech Taiwan Co., Ltd was completed
New Taiwan Application Center was opened

Appointment of Mr. Hitoshi Yoshida as Chairman and CEO.
Appointment of Mr. Ryuichi Kimura as President and COO.
Due to the revision of the market classification of the Tokyo Stock Exchange, the Company moved to the Prime Segment

Construction of Hanno plant of Semiconductor Company was completed