ChaMP332
Fusing the acquired technology of precision measuring instrument and semiconductor manufacturing equipment, Accretech fully meets the process performance required in advanced devices, and proposes CMP systems (ChaMP series) for 300 mm wafer responded to the demand from volume-production plant.
Feature
Air-float Head "Sylphide"
Reference polishing is made possible via an air cushion that provides uniform pressure distribution
Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure controllability and stability
Zone control is available
Simple Maintenance for Polishing Heads - Ring Change
Demounting (approximately 5 seconds)
Mounting (approximately 10 seconds)
1. Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place
2. Attach the snap ring round the whole circumference and slide the cover down
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