Semiconductor Manufacturing Equipment
PG3000RMII
Φ300mm
Φ200mm
High accuracy grinding/polish equipment covers device miniaturization and thinning process in recent years
Significantly renewed RM mechanism (DC tape attachment and BG tape demounting)

PG3000RMII

Feature

Realizes damage-free processing through high accuracy grinding and wet polishing

Enables high throughput (20 WPH @ 25 um)

Supports gettering function for memory device

RM (DC tape attachment and BG tape demounting) system suitable for thin items process

User-friendly operability and equipped with operation analysis system

PG3000RMII