SEMICON Japan 2025

Name: SEMICON Japan 2025
Start: 2025-12-17
End: 2025-12-19T23:59:59+09:00
Location: 日本

Date Host Area Venue Official website Booth No. Our booth overview Exhibit machines

Date

2025-12-17(Wed) to 2025-12-19(Fri)

Host Area

Japan

Venue

Tokyo Big Sight

Official website

https://www.semiconjapan.org/en

Booth No.

East Hall 5 E5446

Our booth overview

Tokyo Seimitsu is actively pursuing technological development in both the semiconductor manufacturing equipment and precision measuring instrument businesses, and we will be making proposals that will contribute to improving productivity in your manufacturing processes.This year, under the theme “Gaging the Future with Metrology, Creating the Future with Semiconductors,” we will introduce semiconductor manufacturing equipment that supports PLP (Panel Level Package) and solution examples focused on semiconductor substrates (wafer measurement) using our precision measuring instrument.

We look forward to seeing you at our booth.

Exhibit machines

	New-Generation Ultra-High-Performance Probing Machine for large probe card and test head Supports PLP（Panel Level Package）	Fully automatic blade dicing machine that supports large packages	Precision Measuring Instrument

Products	AP3000eW	AD3000TW	Precision Measuring Instrument
Overview	AP3000W/AP3000eW is a new-generation ultra-high- performance probing machine which achieves high precision, high throughput (index move, wafer handling, and wafer alignment), low vibration and low noise. The functions and operability of AP3000W/AP3000eW keep from AP3000/AP3000e, and it is possible to have special interface which can dock with large probe card and test head. AP3000W/AP3000eW also maintains campatibility of recipe and map data for your continuing use.	The dedicated design is specialized for large package substrate dicing, starting with the fan-out WLP. Selecting the special dicing frame and jig table contributes to support of application of multiple sheets to the package substrate, enhanced productivity, and reduced cost.	As the only semiconductor manufacturing equipment manufacturer with metrology business, we will be presenting precision measuring instruments that are ideal for measurement of parts to semiconductor manufacturing equipment. In addition to introducing our products that integrate our semiconductor manufacturing equipment and measurement technologies, we will also be presenting precision measuring instruments that are ideal for part measurement to semiconductor manufacturing equipment manufacturers at this year's SEMICON JAPAN. This year, we will focus on semiconductor substrates (wafer measurement) and introduce solution examples using our non-contact measurement instruments: 3D white light interference microscope Opt-scope and the new non-contact displacement detector ACCHROS. We will also exhibit following actual measuring instruments. - Non-contacted/Three-dimensional Surface Roughness and Contour Measuring Instrument: Opt-scope R NEX - Surface Roughness and Contour Measuring Instrument: SURFCOM NEX
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