SEMICON Japan 2024

Name: SEMICON Japan 2024
Start: 2024-12-11
End: 2024-12-13T23:59:59+09:00
Location: 日本

Date Host Area Venue Official website Booth No. Our booth overview Exhibit machines

Date

2024-12-11(Wed) to 2024-12-13(Fri)

Host Area

Japan

Venue

Tokyo Big Sight

Official website

https://www.semiconjapan.org/en

Booth No.

East Hall 3 3148

Our booth overview

Tokyo Seimitsu is actively pursuing technological development in both the semiconductor manufacturing equipment and precision measuring instrument businesses, and we will be making proposals that will contribute to improving productivity in your manufacturing processes.

This year, we will be introducing our solutions in the packaging field as a participant of Advanced Packaging and Chiplet Summit (APCS), as well as introducing precision measuring instruments for semiconductor-related fields.

We look forward to seeing you at our booth.

Exhibit machines

	Fully automatic blade dicing machine that supports large packages	Semi-automatic dicing machine for thick substrates, difficult-to-machine materials and Φ300mm wafers	New-Generation Ultra-High-Performance Probing Machine for large probe card and test head	Precision Measuring Instrument

Products	AD3000TW	SS30PLUS	AP3000eW	Precision Measuring Instrument
Overview	The dedicated design is specialized for large package substrate dicing, starting with the fan-out WLP. Selecting the special dicing frame and jig table contributes to support of application of multiple sheets to the package substrate, enhanced productivity, and reduced cost.	Support for a 3- to 5-inch, large diameter blade is available. High load processing is supported such as hard and brittle materials such as glass and ceramics, thick workpieces, and grooving with a thick blade.	AP3000W/AP3000eW is a new-generation ultra-high- performance probing machine which achieves high precision, high throughput (index move, wafer handling, and wafer alignment), low vibration and low noise. The functions and operability of AP3000W/AP3000eW keep from AP3000/AP3000e, and it is possible to have special interface which can dock with large probe card and test head. AP3000W/AP3000eW also maintains campatibility of recipe and map data for your continuing use.	As the only semiconductor manufacturing equipment manufacturer with metrology business, we will be presenting precision measuring instruments that are ideal for measurement of parts to semiconductor manufacturing equipment. In addition to introducing our products that integrate our semiconductor manufacturing equipment and measurement technologies, we will also be presenting precision measuring instruments that are ideal for part measurement to semiconductor manufacturing equipment manufacturers at this year's SEMICON JAPAN. We will also exhibit following actual measuring instruments. - Non-contacted/Three-dimensional Surface Roughness and Contour Measuring Instrument: Opt-scope - Surface Roughness and Contour Measuring Instrument: SURFCOM NEX - Surface Texture Measurement: SURFCOM TOUCH 50 - Multi-sensor Coordinate Measuring Machine: ZEISS O-INSPECT
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