Semiconductor Manufacturing Equipment
SS30PLUS
Semi-Automatic
Blade
Φ300mm
Electronic Components
Single Spindle
Semi-automatic dicing machine for thick substrates, difficult-to-machine materials and Φ300mm wafers

SS30PLUS

Support for a 3- to 5-inch, large diameter blade is available.
High load processing is supported such as hard and brittle materials such as glass and ceramics, thick workpieces, and grooving with a thick blade.

Features

Achieves easy operation of material processing in the slicing region
For hard and brittle materials, and high-precision grooving processing with a thick blade, operation by a skilled worker is necessary as there are many cases of slicer selection, and alignment and recipe setting are complex. The SS30PLUS is equipped as standard with a highly scalable software feature developed in blade dicing, and supports high-precision dicing with simple operation that is compatible with the AD/SS Series. 

Supports a 3- to 5-inch blade
It is ideal for hard and brittle materials, and high-precision grooving processing with a thick blade, as it uses a 3- to 5-inch, large diameter blade. 
The standard specification can handle up to a Φ 300 mm workpiece. Depending on the size of the substrate for processing, the table size can be customized. 

Ultra-high output spindle equipped as standard
Rating of 2.5 kW, maximum rotation speed 30 krpm

Enhanced productivity (throughput)
Gate type structure + servomotorization of the X, Y, Z axes
Both a reduced footprint and high throughput are established

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used. 
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved. 
The device is equipped with an operation system in common with the AD/SS Series whose use is familiar.

Specifications

Maximum work size  Φ 300 mm, 300 mm×250 mm 
Spindle Layout Single spindle
Spindle Rating  2.5 kW
Spindle Highest number of rotations 30,000 rpm
X axis Send speed entry range 0.1-300 mm/sec
X axis Return speed 800 mm/sec
Y axis Resolution 0.078 μm
Y axis Positioning precision 0.002 mm/310mm
Y axis Repeatability 0.001 mm
Z axis Standard compatible blade diameter 

Selectable:
Φ 76 to 110
Φ 90 to 130

Specifications Dimensions(W x D x H) 890 mm×1,090 mm×1,625 mm
Specifications Weight 840 kg

Maintenance

Maintenance