Feature
Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness
The non-contact measuring method achieves the stable alignment
Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer
The modular concept to make the optimum process line possible
Low damage grinding method is available, Mirror Finish
Machine specification ready for 2" to 6" wafer or for 4" to 8" wafer
Capable of various material processes, such as chemical compound semiconductor(Si,SiC,GaN,GaAs,LT,Sapphire,etc...)
Related Products
