Semiconductor Manufacturing Equipment
W-GM-6200
450mm
Edge Grinder for Forefront 450 mm Wafer

W-GM-6200

Feature

Wafer Size Φ 450 mm

Best Seller Machine W-GM-Series

Improve the Space Efficiency by the Compact Design

Highly Accurate Grinding by the Synchronized X, Y, θ Support Control

Easy Operation by Touch Panel

Automatic feed-back of processing result will be given

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