Feature
Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness.
The non-contact measuring method achieves the stable alignment.
erforms the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer.
The modular concept to make the optimum process line possible.
Low damage grinding method is available.
Machine specification ready for 300 mm wafer.
Visual system (optional) for measuring the chamfer width of periphery and notch.
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