Features
Pre-cut process is essential for achieving excellent dicing quality. One of the problems was the long operation time.
The RGC series Conditioning Plate™ can drastically reduce the processing time required for pre-cut.
Conditioning Plate™ can remove initial blade eccentricity and expose a sufficient amount of grid .
ACCRETECH provides the recommended conditioning parameters.
Specifications
Conditioning plate lineup for each blade mesh size.
Product type and notation
Size
| FS | Full size |
| HS | Half size |
* Please consult with us for customized dimensions.
| Specifications | Bond | Grit type | Thickness Tolerance ±0.05 |
Blade mesh size |
| RGC20 | Resin type | GC | 1mm | #2000 |
| RGC30 | #3000 | |||
| RGC35 | #3500 | |||
| RGC40 | #4000 | |||
| RGC50 | #5000 | |||
| RGC60 | #6000 |
Processing Target and Processing Example
By using the RGC series for conditioning, the condition of the dicing blade tip can be well optimized.
The required processing time is one-sixth of that for silicon wafer pre-cutting.
Si wafer precut
RGC conditioning
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