Features
The RGC series conditioning plate significantly reduces the startup time of the fine-grained blade.
By using it before wafer dicing of the silicon or the compound semiconductor, etc., an excellent unclogged state of the blade tip is achieved, so improving the processing product rank.
This achieves a significant reduction in the required time compared to the conventional process.
Specifications
The lineup of blade types according to each grit diameter
Product type and notation
Size
| FS | Standard specification size |
| HS | Half size |
* Please consult with us for customized dimensions.
| Specifications | Bond | Grit type | Thickness | Application |
| RGC-20 | Resin type | GC | 1mm | #2000 |
| RGC-30 | Resin type | GC | 1mm | #3000 |
| RGC-35 | Resin type | GC | 1mm | #3500 |
| RGC-40 | Resin type | GC | 1mm | #4000 |
| RGC-50 | Resin type | GC | 1mm | #5000 |
| RGC-60 | Resin type | GC | 1mm | #6000 |
Processing Target and Processing Example
Silicon pre-cut and dressing plate Blade tip comparison of RGC series
Silicon pre-cut
When using RGC
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