Features
Pursued the reduction of chipping and high speed cutting
A unique plating technology provides for even distribution of the grit and performance stability
Extensive lineup can meet the variety of demands
By combining, it can cope with variety of cutting, from the step cutting to the full cutting
Processing Target
Silicon
Compound wafers
SiC
LT/LN
Processing Example
LCDD cutting example
SiC
LiNbO3
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