Cleaning System
Automatic Cleaning System for φ300mm wafer
A-CS-300
This device is optimal for spin washing and drying workpieces cut and grooved with a semi-automatic dicing machine, for example. It exhibits excellent cleaning capabilities by matching the air acceleration cleaning and swing arm type cleaning nozzle’s driving range to the workpiece size.
It can support a frame of up to Φ 300 mm.
Features
Usable up to a fast rotation of 3000 min-1
Available frame size: 5 to 12" (Accretech standard frame type)
Air acceleration cleaning, rinse washing, and air drying are supported as standard
High pressure cleaning is available as an option
Specifications
| Supported frame size | Φ300 mm |
| Number of table rotations | 30 to 3000 min-1 |
| Air acceleration washing | Pure water (0.3 Mpa 0.2 L/min) |
| ＋Fluid mixed with air (0.4 Mpa 100 L/min) | |
| Rinse washing pressure | 0.4 MPa or less |
| Air drying pressure | 0.7 MPa or less |
| Power supply | Three-Phase AC200 V 50/60 Hz |
| Maximum consumed electric power | 3 kVA |
| Air source | 0.5 to 0.7 MPa 200 L/min (ANR) |
| Water source | 0.2 to 0.5 Mpa 2 L/min |
| Dimensions (W x D x H) | 490 x 650 x 1,400 mm |
| Weight | 160 kg |
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