Semiconductor Manufacturing Equipment
Metal Bond Blade : GM Series
Dicing
Cutting
Blade
Glass
Quartz
The GM Series is specialized for cutting a variety of types of glass, such as borosilicate glass, fused quartz, and glass with various films.

Metal Bond Blade : GM Series

Metal blade series specialized in glass cutting.
Backside chipping and film peeling are improved to enable high-speed cutting.

Features

Metal blade series specialized in glass cutting

With high rigidity, it can handle the thin blade with great straightness, it can also perform the high-speed cutting

Extensive bond lineup can meet the variety of applications

Processing Target

Various types of glass

Ceramics

Processing Example

  XD800 GM410 , 5mm/s XD1000 GM410 , 5mm/s
Surface Backside Surface Backside
Bolosillicate
glass(*1)
t:0.7mm
Processing Example1 Processing Example2 Processing Example3 Processing Example4
Quartz
glass(*2)
t:0.5mm
Processing Example5 Processing Example6 Processing Example7 Processing Example8

Young’s module : *1≒75GPa *2≒71GPa