Metal Bond Blade : HM Series
Features
High sintering technologies bring out the properties to correspond to the various applications
Unique manufacturing processes provide uniform distribution of grit, and performance stability
Improved the high cutting ability and wear resistance using the special grit
Accumulated plenty of successful cases of QFN cuttings
Processing Target
Various types of electronic parts
Various types of electronic substrates
Glass
Ceramics
Processing Example
QFN package cutting
Resin blade is generally used in QFN cutting field, however it can be cut by metal blade as well. Metal blade is expected to be a long life blade to cut QFN.
Glass processing
It has a large share of this cutting field. It has a good reputation for cutting quality and performance stability.
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