Semiconductor Manufacturing Equipment
P102E
Additive dropping equipment
Additive dropping equipment supporting high flow rates

P102E

The P102E allows you to set a desired concentration of additive. Using a micropump, this equipment injects the amount of additive proportional to the flow rate of the cutting water and mixes it with pure water, thus supplying a uniform concentration of additive to the dicing machine.

Features

The amount of additive proportional to the flow rate of the cutting water can be dropped
By operating its pump in response to small fluctuations in the source pressure of the cutting water, the equipment constantly drops a uniform concentration of additive.

Reduced footprint design
A polyethylene tank of a certain size can be installed in the equipment. Even if the tank becomes empty, the equipment can continue its operation for a certain period of time by using a buffer tank built in it.

A 7-inch touch panel offers a GUI for quick intuitive operations

Mechanism designed to prevent additive from fixing
The P102E comes standard with a mechanism that automatically keeps additive circulating inside it even when the equipment is stopped (except when the equipment is powered off).

Manual operation and automatic operation from the dicing machine are both supported
In automatic operation mode, the concentration can be changed from the dicing machine side.

Dropping amount interlock
The dropping amount can be monitored using the conductivity and an ultraprecision flow rate sensor (option).

Specifications

  Unit P102E
Concentration setting range % 0.005 to 0.030
Flow range L/min 2 to 20
Pure water supply pressure (max.) MPa 0.5
Supplied pure water temperature 20 to 25
Dimensions mm 245×395×1,024
Weight (when dry) kg 60