AL3000

High quality removal is performed of low-K material above the dicing street and metal, for example, using the UV laser beam.
Achieves both high quality processing and high throughput with a unique laser engine mechanism.

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Features Specifications Laser Grooving Process Plasma Dicing Process

Features

Achieves both high quality processing and high throughput with a unique laser engine mechanism
With the conventional laser grooving process, establishing both high-quality processing as well as throughput is difficult, so there is a trade-off relationship.
A high-quality, high throughput laser grooving process is provided in which the trade-off has been eliminated through the combination of our original laser engine mechanism + the high-rigidity platform.

Φ 300 mm wafer compatible, fully automatic laser grooving machine
Automatically supports a series of processes from water-soluble protective film distribution to laser dicing and cleaning.

Supports a laser grooving process
The optical design is ideal for low-k grouping and removal of TEG from above the street.
Processing distortion and damage due to heat are kept to a minimum, and a stable processing groove is formed.

Operability
A 17-inch touch panel + GUI (Graphical User Interface) are used.
Simply by touching the iconized buttons, straightforward and comfortable operation is achieved.
The device is equipped with an operation system in common with the AD/SS Series whose use is familiar.

Specifications

Model Name		AL3000
Processing method		Ablation
Laser oscillator		Semicondoctor Laser excitation Q-Swith Solid State Lasor
Wavelength		355 nm
Max. workpeice size		Φ 305 mm
Cutting stroke		310 mm x 310 mm
X-axis	Max. Mooving speed	1,000 mm/sec
Y-axis	Max. Mooving speed	300 mm/sec
Y-axis	Positioning accuracy	0.078 μm
Z-axis	Max. Mooving speed	10 mm/sec
Z-axis	Repeatabillity accuracy	1.0 μm
θ-axis	Max. rotating angle	380.0 deg

Power supply	3-phase 200 ～ 220VAC±10% 50/60Hz (380, and 415 V are available with optional transformer)
Power consumption	2.0 kVA（Reference calues）
Air supply pressure	0.5 ～ 0.7 MPa
Average air consumption	400 L/min
N2 supply pressure	0.3 ～ 0.5 MPa
N2 average consumption	30 L/min
DI water supply pressure	0.3 ～ 0.5 MPa
Maximum DI water consumption flow rate	6.0 L/min
Exhaust	4.0 m³/min or more
Dimensions WxDxH	1,645 mm x1,680 mm x1,800 mm
Machine weight	2,500 kg

*In addition to the above, a chiller unit and dust collector are included as ancillary equipment.