Semiconductor Manufacturing Equipment
Nickel Bond Blade : MN HALF SLIT Type
Dicing
Cutting
Blade
High-rigid
MLCC
Thin Blade
Raw Ceramics
The MN type half-slit has improved the lateral dischargeability and further improved the processing stability.

Nickel Bond Blade : MN HALF SLIT Type

Evolved MN series that meets high blade needs of rigidity.
Inheriting the efficiency of MN type and solve the problem of blade breakage.

Features

Retaining the same rigidity with MN type

Preventing the cutting powder adhesion on the blade surface

Available to make slits on ultra-thin blade. Therefore enable to retain the cooling effect and the discharging effect of cutting powder

Prevent breakage of ultra-thin blade

In ultra-thin blade, it is possible to restrain the breakage easily occurred from a slit by changing ordinary slit to half slit.

Features