Dicing
Cutting
Blade
Substrate
Electronic Components
Thin Blade
High-rigid
The nickel hubless blade has a proven record of responding to a range of demands, such as for various wafer types and composite substrates.
Nickel Bond Blade : DS Type
Features
High accuracy and high-speed cutting
Excellence in blade rigidity and abrasion resistance
Sharp cutting ability, effective on burrs occurring
3 concentration levels are available
Expansion of the application by adding variations to the slit shape
Processing Target
Raw ceramics
Chip LED
Various types of substrates
Hard, brittle materials
Processing Example
Through hole cutting
ACCRETECH AD2000T
UV- TAPE (PET TYPE)
30,000 min-1
150mm/sec
Electrode cutting
ACCRETECH AD2000T
UV-TAPE (PO TYPE)
18,000 min-1
50 mm/sec
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