Semiconductor Manufacturing Equipment
Resin Bond Blade : PG Series
Dicing
Cutting
Blade
QFN
Burr
The PG Series supports not only standard QFN but also next-generation QFN such as wettable QFN.

Resin Bond Blade : PG Series

Resin blade series for lead frame package cuttings.
Realizes high cutting quality and long life.

Features

Resin blade series for lead frame packages such as QFN and DFN

A variation is expanded in pursuit of the high-speed cutting, long lifespan, and stable cutting quality

Available with the latest Wettable type and DR-QFN

Processing Target

Lead frame packages

Various types of electronic parts

Processing Example

QFN cutting example

High-quality cutting can be achieved by minimizing burrs under high-speed conditions.

QFN cutting example

Wettable Flank QFN cutting example

A good wettable shape that suppresses burrs and smearing.

Wettable Flank QFN cutting example