Semiconductor Manufacturing Equipment
Nickel Bond Blade : MN Type
Dicing
Cutting
Blade
MLCC
Raw Ceramics
Thin Blade
High-rigid
Nickel and MN type supports raw ceramic green sheet cutting with its strong cutting property and high rigidity.

Nickel Bond Blade : MN Type

Evolutionary version of standard type in response to the needs of ultra-thin blade.
MN type has realized the rigidity of more than 1.5 times succeeding the standard bond lineup and enables the high-speed cutting.

Features

Based on the standard type, rigidity was upgraded to its limit and straightness was improved

Realized a high quality cutting surface by controlling the amount of grit protrusion on the lateral face of the blade

Decrease in the grit shedding on the lateral face of the blade contributed to prevent the blade from becoming thinner

Lessening adhesion of cutting powder to the blade surface

Cutting ability improvement due to the special slits

Processing Target

Raw ceramics

LED chip

Various types of substrates

Hard, brittle materials

Rigidity comparison

MN type has rigidity of more than 1.5 times succeeding the standard bond line, which enables the high-speed cutting by ultra-thin blade in increasingly demands.

Rigidity comparison

Processing Example

Green sheet processing example

MN type enables cutting in good condition even if the intermediate dress frequency is decreased by preventing shape change of blade due to the falling abrasive grains on the side and by minimizing mistakes on and adhesion to the blade

DS Type
DS Type
MN Type
MN Type