Semiconductor Manufacturing Equipment
Metal Bond Blade : YM/AM Series
Dicing
Cutting
Blade
Alumina
AlN
The YM/AM Series enables high quality cutting of AIN, SIN, and high purity Al₂O₃.

Metal Bond Blade : YM/AM Series

Metal blade series capable of cutting high-purity ceramics.
Realizes extended life of blades.

Features

Metal blade series specialized in the ceramics cutting

Higher rigidity than the resin blade allows better straightness and higher-speed cutting

Higher wear resistance than the resin blade enables longer life time

Features

Processing Target

Ceramics

Various types of electronic parts

Various types of electronic substrates

Glass

Processing Example

Alumina substrate LED cutting (AM Series)

AM series holds the sharp cutting performance for providing the vertical cutting capability to resolve a protrusion issue in segmentation process beyond the cutting ability of conventional metal blade.

Alumina substrate LED cutting (AM Series)

LTCC cutting (YM Series)

Improved cutting ability has realized the cutting without chipping and cracking even for thick LTCC.

LTCC cutting (YM Series)

Al₂O₃ substrate

Al₂O₃ substrate

SiN substrate

SiN substrate